Microelectromechanical Systems (MEMS) have captured the interest of the
public with their promise to miniaturize existing systems. Although
much of the excitement surrounding MEMS has died down, real applications
are beginning to emerge. MEMS accelerometers for games, automotive,
and wireless applications have emerged. MEMS inkjet chips are now
ubiquitous, and new applications for RF and sensors are in development.
One of the most challenging aspects of MEMS is packaging. Forces that
normally do not affect meso-scale objects must be understood and
controlled at the micro-scale. This has created a number of challenges
related to the packaging of these components. MEMS Technology is an
online course that offers detailed instruction on the design,
processing, packaging, and reliability of MEMS devices. We also cover
Deep Reactive Ion Etching (DRIE), surface-to-volume ratio issues,
electrostatics, liquid wetting, inertia, and other parameters.